发明名称 ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To reduce contact resistance between first and second electrodes, with respect to an acoustic wave device which has the first electrode, and the second electrode laminated at a part of the upper surface of the second electrode to be electrically connected to the first electrode, and in which patterning using alkali developer is performed between first and second electrode formation processes, and a method for manufacturing the same. <P>SOLUTION: There are provided the acoustic wave device and its method, wherein the first electrode 21 to be electrically connected to an IDT electrode 2 is formed on a piezoelectric substrate 1, at least the upper surface of the first electrode 21 is constituted of alloy which includes metal soluble to alkali and metal insoluble to alkali, in which content of the metal insoluble to alkali to the metal soluble to alkali is 5-20 wt.%, the patterning by the alkali developer is performed after formation of the first electrode 21, and after that, the second electrode 26A to be electrically connected to the first electrode 21 by being laminated at a part of the upper surface of the first electrode 21 is formed. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010050726(A) 申请公布日期 2010.03.04
申请号 JP20080213012 申请日期 2008.08.21
申请人 MURATA MFG CO LTD 发明人 TSUDA MOTOTSUGU;HIGASHIDE GOYA;TAKATORI KOJI
分类号 H03H3/08;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H01L41/29;H03H9/145;H03H9/25;H03H9/64 主分类号 H03H3/08
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