发明名称 FIXING METHOD AND SEPARATION METHOD FOR CONTACTLESS IC TAG
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a fixing method and a separation method for a contactless IC tag, allowing reuse of the used contactless IC tag by allowing easy uninstallation and separation of the contactless IC tag fixed to an article or the like without imparting damage to a function of the contactless IC tag. <P>SOLUTION: An adhesive layer is formed on at least one face of the contactless IC tag 4, and it is sandwiched between the rear face of a heat-shrinkable shrink film 5 and the outer face of a vessel 1 and is fixed. The adhesive layer is formed on only the one face of the contactless IC tag 4, and the contactless IC tag 4 adheres to the vessel 1 and is left when tearing off the heat-shrinkable shrink film 5. Otherwise, the adhesive layers are formed on both the faces of the contactless IC tag 4, and the contactless IC tag 4 adheres to a part of the heat-shrinkable shrink film 5 and is left when tearing off the heat-shrinkable shrink film 5, so that the contactless IC tag 4 is separated and is reused. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010049410(A) 申请公布日期 2010.03.04
申请号 JP20080211926 申请日期 2008.08.20
申请人 NEC TOKIN CORP 发明人 HAYASAKA HIROSHI
分类号 G06K19/077;B65D25/20;B65D77/24;G06K19/07 主分类号 G06K19/077
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