发明名称 LASER MACHINING APPARATUS AND LASER MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus and a laser machining method capable of highly accurately machining even a work having irregular surface displacement of a laser beam irradiation region without measuring the surface displacement of the work in advance by correcting the condensing position of a laser beam in real-time, irrespective of the thickness of the work. <P>SOLUTION: In the laser machining apparatus, a machining means irradiates the work 10 held in a holding means with a machining laser beam while adjusting the position of a condensing lens 33 provided on the machining means by a condensing position adjusting means based on the surface displacement of the work 10 detected by a surface displacement detecting means. A light source 41 for detection provided on the surface displacement detecting means can oscillate a light of a plurality of wavelengths different from that of the laser beam, and a wavelength selecting section 45 selects a certain wavelength used as a detection light from the plurality of wavelengths, and the detecting light of the selected wavelengths is gathered by the condensing lens 33 and the work 10 is irradiated with the light. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010046703(A) 申请公布日期 2010.03.04
申请号 JP20080214856 申请日期 2008.08.25
申请人 DISCO ABRASIVE SYST LTD 发明人 FURUTA KENJI;NOMARU KEIJI
分类号 B23K26/04;B23K26/00;B23K101/40 主分类号 B23K26/04
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