METHOD OF PRODUCING WIRING BOARD AND WIRING BOARD OBTAINED BY THE PRODUCING METHOD

摘要

<P>PROBLEM TO BE SOLVED: To provide a method of producing a wiring board forming a circuit that allows highly accurate preservation of a profile of a predetermined circuit pattern by a simple method in preparation of a fine circuit by an additive method. Ž<P>SOLUTION: The method of producing a wiring board includes: a film forming step of forming a swellable resin film 2 on a surface of an insulative substrate 1; a circuit groove forming step of forming circuit grooves 3 having a depth equal to or greater than the thickness of the swellable resin film 2 on the external surface of the swellable resin film 2; a catalyst depositing step of depositing a catalytic metal 5 on the surface of the circuit grooves 3 and the surface of the swellable resin film 2; a film separating step of swelling the swellable resin film 2 with a predetermined liquid and then separating the swellable resin film 2 from the surface of the insulative substrate 1; and a plating processing step of forming an electrolessly plated film 6 only in the region where the catalytic metal 5 remains unseparated after separation of the swellable resin film 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž