| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for grinding a wafer capable of efficiently grinding the wafer. SOLUTION: In this method, a grinding device including a rotatable chuck table provided with a holding surface for holding the wafer, a grinding means rotatably mounted with a grinding wheel for grinding the wafer held on the chuck table, and a grinding feed means for approaching and separating the grinding means in a direction perpendicular to the holding surface of the chuck table is used. The method includes a rough grinding process for grinding by approaching the grinding means to the wafer held on the chuck table by operating the grinding feed means and bringing the grinding wheel into contact with the wafer at fixed grinding feed speed, a finishing grinding process for carrying out grinding at the fixed grinding feed speed by increasing the number of rotation of the grinding wheel before reaching finishing thickness of the wafer, and a grinding finishing process for separating the grinding wheel from the wafer held on the chuck table by reversing the grinding feed means when thickness of the wafer reaches the finishing thickness. COPYRIGHT: (C)2010,JPO&INPIT
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