| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved mounting device for mounting conductive balls on pads to be arrayed in predetermined patterns. SOLUTION: The device for mounting conductive balls includes a transfer device which includes one surface and the other surface facing the one surface, an arrangement member including a positioning opening portion opened on one surface and the other surface and for passing through balls, two or more linear members whose cores are substantially aligned, and holding members for fixing ends of the linear members so that a curved abdominal portion is formed on the linear members. The arrangement member is positioned while the other surface of the arrangement member is against one surface of the pads to be arrayed. The transfer device makes the abdominal portion of the linear members come in contact with one surface of the arrangement member, the abdominal portion being arranged while coming into contact in a posture substantially horizontal to the balls provided on one surface of the arrangement member and being relatively horizontally moved to one surface of the arrangement member; and accordingly, the balls provided on one surface of the arrangement member are caught by the abdominal portion of the linear members and inserted to the positioning opening portion. COPYRIGHT: (C)2010,JPO&INPIT
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