| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an FIB cross-section processing method capable of carrying out a cross-section processing with high accuracy relating to an FIB cross-section processing method, and a method of manufacturing a semiconductor apparatus that uses results of cross-section analysis for products using the processing method. Ž<P>SOLUTION: The FIB cross-section processing method obtains a cross section in which an analysis point 8 is exposed by the following steps of: performing a crude processing 9 to a semiconductor chip by FIB when the analysis point 8 of the semiconductor chip locates at a first cross point where an end side of a first pattern and that of a second pattern cross; forming a triangle whose vertexes are a second cross point α where the crude processed cross section 9a obtained by the crude processing 9 and the end side of the first pattern cross, a third cross point β where the crude processed cross section 9a and the end side of the second pattern cross, and the first cross point 8; calculating a distance b between the crude processed cross section 9a and the first cross point 8 by using a side length or an angle θ of the triangle; and performing cross-section processing to the semiconductor chip for the distance b from the crude processed cross section 9a by FIB. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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