发明名称 |
COPPER PAD FOR COPPER WIRE BONDING |
摘要 |
An integrated circuit package comprising an integrated circuit that includes transistors coupled to copper interconnect structures. The integrated circuit package also comprises copper pads located on the integrated circuit and directly contacting uppermost ones of the copper interconnect structures. Each of copper pads has a thickness of at least about 2 microns. The integrated circuit package further comprises copper wires pressure-welded directly to the copper pads.
|
申请公布号 |
US2010052174(A1) |
申请公布日期 |
2010.03.04 |
申请号 |
US20080198946 |
申请日期 |
2008.08.27 |
申请人 |
AGERE SYSTEMS INC. |
发明人 |
BACHMAN MARK;OSENBACH JOHN |
分类号 |
H01L21/60;H01L21/768;H01L23/488 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|