发明名称 GROUP III-NITRIDE SEMICONDUCTOR THIN FILM, METHOD FOR FABRICATING THE SAME, AND GROUP III-NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 Disclosed herein is a high-quality group III-nitride semiconductor thin film and group III-nitride semiconductor light emitting device using the same. To obtain the group III-nitride semiconductor thin film, an AlInN buffer layer is formed on a (1-102)-plane (so called r-plane) sapphire substrate by use of a MOCVD apparatus under atmospheric pressure while controlling a temperature of the substrate within a range from 850 to 950 degrees Celsius, and then, GaN-based compound, such as GaN, AlGaN or the like, is epitaxially grown on the buffer layer at a high temperature. The group III-nitride semiconductor light emitting device is fabricated by using the group III-nitride semiconductor thin film as a base layer.
申请公布号 US2010055883(A1) 申请公布日期 2010.03.04
申请号 US20090612206 申请日期 2009.11.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD.;THE UNIVERSITY OF TOKUSHIMA 发明人 CHOI RAK JUN;SHIRO SAKAI;YOSHIKI NAOI
分类号 H01L21/20;H01L33/06;H01L33/12;H01L33/16;H01L33/32 主分类号 H01L21/20
代理机构 代理人
主权项
地址