发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To solve the following problem: when a ceramic laminate provided in a multilayer ceramic electronic component is made thin, stress is apt to concentrate on a boundary between a part covered with an external electrode and a part which is not covered owing to a swell of a glass component from the external electrode and then a crack is apt to occur. SOLUTION: Ceramic constituting a protective layer 14 providing a surface layer portion defining an external surface of the ceramic laminate 3 and a body portion 15 other than the protective layer 14 has a composition which contains in common as a principal component a perovskite type compound expressed by ABO<SB>3</SB>(wherein A contains Ba, or Ba and at least one of Ca and Sr, and B contains Ti, or Ti and at least one of Zr and Hf), and contains Si as an accessory component, however the composition of the protective layer 14 is higher in A/B ratio than the composition of the body portion 15, and also made larger in Mg content or rare earth element content to increase the Si concentration of the protective layer 14. COPYRIGHT: (C)2010,JPO&amp;INPIT
申请公布号 JP2010050263(A) 申请公布日期 2010.03.04
申请号 JP20080212844 申请日期 2008.08.21
申请人 MURATA MFG CO LTD 发明人 SASABAYASHI TAKEHISA;NAKAMURA TOMOYUKI;MATSUNO SATORU
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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