发明名称 |
BALL MOUNTING APPARATUS AND METHOD |
摘要 |
A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.
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申请公布号 |
US2010051671(A1) |
申请公布日期 |
2010.03.04 |
申请号 |
US20070515900 |
申请日期 |
2007.11.22 |
申请人 |
LING NEE SENG;ANG SOO LOO;PAI TER SIANG |
发明人 |
LING NEE SENG;ANG SOO LOO;PAI TER SIANG |
分类号 |
B23K31/12;B23K1/20;B23K3/06;B23K3/08 |
主分类号 |
B23K31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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