| 摘要 |
PURPOSE: A COF(Chip On Film) substrate is provided to prevent the COF substrate from being locally drastically folded by opening a easily foldable region flat. CONSTITUTION: A wiring pattern welded with a semiconductor device is arranged on an insulation film(2). A pattern(3) for heat dissipation is arranged in a surface facing the side placing the wiring pattern of the insulation film. A plurality of openings(5) is formed in a pattern for heat dissipation of the folding region of the COF substrate. A plurality of openings is formed to the direction(A-A') perpendicular to the folding direction(B-B'). The opening is formed to an ellipse form. |
