| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a junction structure of substrates and a joining method which can stably join the substrates and achieve high workability during joining. <P>SOLUTION: A second substrate 2 soldered to a first substrate 1 is elastically bent at a bent portion 9. The first substrate 1 is in contact with a portion where a joint 6 on the second substrate 2 is formed, in a direction along which the bending angle of the bent portion 9 increases. In this state, a first joint 5 on the first substrate 1 and the second joint 6 on the second substrate 2 are joined by soldering. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
