| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability, high in heat conductivity when composited with an inorganic filler, and giving moldings having low thermal expansion property and excellent in heat resistance and moisture resistance, and to provide moldings using the composition. Ž<P>SOLUTION: The epoxy resin composition composed mainly of an epoxy resin and a curing agent, or the epoxy resin, the curing agent and an inorganic filler is provided, wherein, as the epoxy resin ingredients, an epoxy resin having unsaturated ketone group represented by formula (1) is used in ≥50 wt.% of epoxy resin ingredients, and, as the curing agent, a bifunctional phenolic compound is used in ≥50 wt.% of curing agent ingredients. (Wherein, R<SB>1</SB>and R<SB>2</SB>are H, halogen atom, 1-8C hydrocarbon or 1-8C alkoxy; and n is a number of 0-50). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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