发明名称 PROCESS FOR PRODUCTION OF VOID-CONTAINING RESIN MOLDINGS AND VOID-CONTAINING RESIN MOLDINGS OBTAINED BY THE PROCESS
摘要 <p>A process for the production of void-containing resin moldings, by which void-containing resin moldings which have high -saturation appearance excellent in brightness and are excellent in heat insulating properties can be produced; and void -containing resin moldings obtained by the process. The process for the production of void-containing resin moldings comprises the step of stretching a polymer molding containing a single crystalline polymer at least uniaxially and is characterized in that in the stress-strain diagram obtained in stretching the polymer molding in the first direction, the stress at 30% elongation (L30) and the yield stress (A) satisfy a specific relationship or in that in the stress-strain diagram obtained in stretching the polymer molding in the first direction, the stress at 40% elongation (L40), the yield stress (A), and the stress (B) at an inflection point where the stress after the yield stress (A) changes first from descent to ascent satisfy a specific relationship.</p>
申请公布号 WO2010024068(A1) 申请公布日期 2010.03.04
申请号 WO2009JP63208 申请日期 2009.07.23
申请人 FUJIFILM CORPORATION;GOTO, YASUTOMO;SASAKI, HIROKI;OGURA, TOORU;ARIOKA, DAISUKE 发明人 GOTO, YASUTOMO;SASAKI, HIROKI;OGURA, TOORU;ARIOKA, DAISUKE
分类号 C08J9/00 主分类号 C08J9/00
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