发明名称 FLASH MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A flash memory device and a manufacturing method thereof are provided to prevent a bridge between a contact plugs by forming a even group contact plug, a pad contact plug, and an odd group contact plug. CONSTITUTION: A flash memory device comprises a first contact plug(124a), a second contact plug(124b), a first and second conductive pads(130a,130b), a first and second pad contact plugs(138a,138b), and a first bit line(BL1) and a second bit line(BL2). The first contact plugs are formed on the semiconductor substrate(100). The second contact plugs is higher than first contact plugs. The first and second conductive pads are connected to the first contact plug. The first bit lines are connected to the first and second pad contact plugs. The second bit lines are connected to the second contact plugs.</p>
申请公布号 KR20100023132(A) 申请公布日期 2010.03.04
申请号 KR20080081740 申请日期 2008.08.21
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM, JAE HEON
分类号 H01L27/115;H01L21/28;H01L21/8247 主分类号 H01L27/115
代理机构 代理人
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