| 摘要 |
PURPOSE: A processing method of an optical device wafer is provided to prevent an affected zone due to a laser machining from being generated by breaking a protecting plate along a breaking point by applying an external force to the protecting plate to which a laser processing process is operated. CONSTITUTION: The surface(2a) of an optical device wafer(2) is contact with the surface of a protecting plate(3) with a high hardness by a glue. The rear side(2b) of the optical device wafer welded in the protecting plate is ground. The rear side of the optical device wafer operating the back-grinding process is adhered to the surface of a dicing tape. The rear side of the protecting plate welded in the optical device wafer adhered in the dicing tape is ground. A laser beam is radiated along the street formed in the optical device wafer of the protecting plate. The optical device wafer is fractured along the street and is divided into respective optical devices.
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