| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate and its production process by which low cost and resource saving are easy to attain. Ž<P>SOLUTION: Primary and secondary ear parts 3 and 4, excised after the reflow-soldering step, are attached at both edge sides of a wiring substrate 1's body 2. The primary ear part 3 consists of two or more first convex parts 3a attached at one edge side of the body 2 in a comb-teeth condition, and the secondary ear part 4 consists of two or more second convex parts 4a attached at the other edge side of the body 2 in a similar condition. The first and second convex parts 3a and 4a are shaped into equally-sized squares, and are alternately and inversely provided on the edge sides of the body 2 in a protruding condition. These wiring substrates 1 are extracted in plural numbers from an aggregated wiring substrate 10, a first ear part 3 of one adjacent wiring substrate 1 on the aggregated wiring substrate 10 and a second ear part 4 of another wiring substrate 1 are alternately installed on the edge sides of the body 2, and a slit 11a going in a direction orthogonal to the edge sides is formed between these ear parts 3 and 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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