| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a scrap of a wafer to be processed from being formed in a substrate processing apparatus owing to trouble of a device for removing harmful substance by combustion for exhaust gas. Ž<P>SOLUTION: The substrate processing apparatus includes a substrate holder 23 for holding a substrate 10, a processing chamber storing the substrate holder and processing the substrate, a substrate conveying section 21 which loads and unloads the substrate to and from the substrate holder, a control section which controls the substrate conveying section to execute a recipe program for performing predetermined processing on the substrate held by the substrate holder in the processing chamber, and a combustion device for combusting the exhaust gas after the processing on the substrate in the processing chamber. The combustion device prepares the exhaust gas processing at the start of the recipe program execution, and the control section starts transferring the substrate to the substrate holder by the substrate conveying section after the exhaust gas processing preparation is completed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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