| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for inspecting a semiconductor device for easily managing the manufacturing process of a semiconductor device by electrically inspecting the film thickness of an insulating film, and for quickly and easily specifying the factor of failure. Ž<P>SOLUTION: The inspection method of the semiconductor device includes the steps of: preparing a semiconductor device having a conductive section interposing an insulating film; measuring the capacity of the insulating film by applying a voltage to the conductive section; and inspecting the film thickness of the insulating film based on the capacity of the insulating film. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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