Printed Circuit Board and Method of Manufacturing the Same

摘要

A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer.