ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND PROCESS FOR PRODUCING THE CONNECTION STRUCTURE

摘要

This invention provides an anisotropic electroconductive material which, when an IC chip or flexible wiring is connected to a wiring board through an anisotropic elctroconductive material, does not cause a difference in continuity resistance between individual bumps and between linear terminals. The anisotropic electroconductive material comprises electroconductive particles dispersed in an insulating binder, has a lowest melt viscosity[η]of 1.0×10to 1.0×10mPa sec, and satisfies formula (1). 1 <[η]/[η]<= 3 (1) wherein[η]represents thelowest melt viscosity of the anisotropic electroconductive material;[η]represents the melt viscosity at a temperature Twhich is 30°C below a temperature Tat which the melt viscosity is the lowest value.