| 摘要 |
PROBLEM TO BE SOLVED: To generate easily inspection information for inspecting existence of formation of a solder bridge on an inspection object substrate mounting on which of electronic components is finished. SOLUTION: A device includes an information processing part 13 for generating inspection information D3 for specifying a probe contact point when inspecting electrically the inspection object substrate wherein each electronic component is connected to each connection point on a conductor pattern. The information processing part 13 generates as the inspection information D3, the first inspection information for executing prescribed electric inspection between a pair of conductor patterns connected mutually through an electronic component, and the second inspection information for executing insulation inspection between a pair of conductor patterns positioned in a distance range wherein mutual connection points are specified beforehand, except the pair of conductor patterns connected mutually through one electronic component, based on connection point information D1 capable of specifying a position on the inspection object substrate of each connection point in each conductor pattern, and on component connection information D2 capable of specifying a connection point in each electronic component. COPYRIGHT: (C)2010,JPO&INPIT
|
