SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES HAVING PLANAR SIZE GREATER THAN THAT OF CONNECTION PAD PORTION OF WIRING LINE, AND MANUFACTURING METHOD THEREOF

摘要

A plurality of wiring lines are provided on a first protective film, a second protective film having an opening in a part corresponding to a connection pad portion of a wring line is provided on the first protective film including the wiring line, a columnar electrode is provided on the upper surface of the connection pad portion of the wring line exposed via the opening in the second protective film and on the second protective film around the connection pad portion.