发明名称 APPARATUS AND METHOD FOR PLASMA PROCESSING
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus for plasma processing capable of widening the area of a processing range, allowing uniform treatment, and capable of changing easily design in response to a processing object. <P>SOLUTION: This apparatus for plasma processing is provided with a reactor R having a plurality of through holes 2 with a plasma generating gas G flowing in from an opening in one end side and with the activated plasma generating gas G flowing out from an opening in the other end side, and having a planar insulating base material 1 provided with a pair of electrodes 3, 4 for generating respectively discharges in the respective through holes 2. The pair of electrodes 3, 4 is formed in layers, and is opposed in a flowing direction of the plasma generating gas G in the through holes 2, to be embedded both-together into the insulating base material 1. A peripheral end part of the electrode 3 of a downstream in the flowing direction of the plasma generating gas G in the through holes 2 is projected more outwards than a peripheral end part of the electrode 4 of an upstream. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010050106(A) 申请公布日期 2010.03.04
申请号 JP20090266165 申请日期 2009.11.24
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 SHIBATA TETSUJI;YAMAZAKI KEIICHI;TAGUCHI NORIYUKI;SAWADA KOJI
分类号 H05H1/24;B01J19/08;B08B7/00;C23C4/00;C23C16/50;C23C16/509;H01J37/32;H01L;H01L21/00;H01L21/205;H01L21/304;H01L21/3065;H05H1/00;H05H1/46;H05K3/26 主分类号 H05H1/24
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