发明名称 BONDED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a novel bonded structure manufactured by bonding various kinds of carbon films and metal materials by soldering, and a method for manufacturing the same. SOLUTION: The bonded structure is composed of a first member 1 and a second member 2, and has a bonding portion 3. The first member 1 includes a substrate 1s and a carbon film 1f which coats at least a part of the surface of the substrate 1s. At least a part of the second member 2 includes a metal material 2. The bond portion 3 is formed by bonding the carbon film 1f and the metal material 2 by soldering. The carbon film 1f contains oxygen in at least the bonded interface 1j. Tin solder 3j of the bond portion 3 contains tin as a main component and one or more selected from a group of zinc and rare-earth elements. The tin solder 3j of the bond portion 3 is chemically bonded to the oxygen contained in the carbon film 1f and also is diffusion-bonded to the metal material 2 or is chemically bonded to oxygen in an oxide formed on the surface of the metal material 2. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010046700(A) 申请公布日期 2010.03.04
申请号 JP20080214546 申请日期 2008.08.22
申请人 TOYOTA CENTRAL R&D LABS INC 发明人 YAMADA YUKA;SUZUKI KENICHI;NAKANISHI KAZUYUKI;OSHIMA TADASHI
分类号 B23K1/19;B23K35/26;B23K101/40;C22C13/00;H01L23/373 主分类号 B23K1/19
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