发明名称 |
BONDED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a novel bonded structure manufactured by bonding various kinds of carbon films and metal materials by soldering, and a method for manufacturing the same. SOLUTION: The bonded structure is composed of a first member 1 and a second member 2, and has a bonding portion 3. The first member 1 includes a substrate 1s and a carbon film 1f which coats at least a part of the surface of the substrate 1s. At least a part of the second member 2 includes a metal material 2. The bond portion 3 is formed by bonding the carbon film 1f and the metal material 2 by soldering. The carbon film 1f contains oxygen in at least the bonded interface 1j. Tin solder 3j of the bond portion 3 contains tin as a main component and one or more selected from a group of zinc and rare-earth elements. The tin solder 3j of the bond portion 3 is chemically bonded to the oxygen contained in the carbon film 1f and also is diffusion-bonded to the metal material 2 or is chemically bonded to oxygen in an oxide formed on the surface of the metal material 2. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010046700(A) |
申请公布日期 |
2010.03.04 |
申请号 |
JP20080214546 |
申请日期 |
2008.08.22 |
申请人 |
TOYOTA CENTRAL R&D LABS INC |
发明人 |
YAMADA YUKA;SUZUKI KENICHI;NAKANISHI KAZUYUKI;OSHIMA TADASHI |
分类号 |
B23K1/19;B23K35/26;B23K101/40;C22C13/00;H01L23/373 |
主分类号 |
B23K1/19 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|