| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems of the unexpected obstruction and the accidental interception of droplets of a series of continuous solder paste jetted from a device. Ž<P>SOLUTION: The device for jetting the droplets of the viscous medium filled with the particle has a nozzle, a jetting mechanism connected to the nozzle, a medium supply mechanism connected to the jetting mechanism, a container for the viscous medium filled with the particle which is connected to the medium supply mechanism and a filter arranged between the outlet of the container of the viscous medium filled with the particle and the medium supply mechanism. The viscous medium filled with the particle is supplied from the container of the viscous medium filled with the particle to the medium supply mechanism. The medium supply mechanism is provided with a rotatable supply shaft and the viscous medium filled with the particle is supplied to the jetting mechanism by the supply shaft. The jetting mechanism is provided with a jetting shaft movable back and forth and the droplets of the viscous medium filled with the particle are jetted through the nozzle by the jetting shaft. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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