| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent excess/deficiency in an inflow amount of underfill even if two semiconductor chips with different dimensions are adjacently disposed. Ž<P>SOLUTION: In a semiconductor chip module 1, semiconductor chips 3 and 4 having different dimensions in a plane view, the underfill 5, and one wall 6A preventing the underfill 5 from flowing out are arranged on a wiring board 2. The wall 6A includes a reservoir part 8 which supplies the underfill 5 only to an injection hole 7 for the underfill 5 and to the semiconductor chip 3. The injection hole 7 is formed of a region surrounded by facing sides 3a and 4a of the semiconductor chips 3 and 4 and a part 6Aa of the wall 6A. The reservoir part is formed of a region surrounded by a part 3b of the facing side 3a of the semiconductor chip 3 and the part 6Aa of the wall 6A. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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