发明名称 |
Method For Polishing A Semiconductor Wafer |
摘要 |
Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.
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申请公布号 |
US2010056027(A1) |
申请公布日期 |
2010.03.04 |
申请号 |
US20090542920 |
申请日期 |
2009.08.18 |
申请人 |
SILTRONIC AG |
发明人 |
ZAPILKO CLEMENS;JAESCHKE THOMAS;TABATA MAKOTO;ROETTGER KLAUS |
分类号 |
B24B1/00;B24B7/17 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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