发明名称 METHOD OF MANUFACTURING RELAY WIRING BOARD, RELAY WIRING BOARD, AND COMPOSITE LEAD FRAME USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing relay wiring boards, wherein utilization efficiency of a material is high and aligning the relay wiring boards is not required, when manufacturing the relay wiring boards. SOLUTION: In this method of manufacturing a multiple surface mounting relay wiring board composed of at least a heat resistant base material, an adhesive layer, and a protective film, all of the thickness of the heat resistant base material, all of the thickness of the adhesive layer, and a part of the thickness of the protective film are cut in the thickness direction from the heat resistant base material side. Thus, the relay wiring board is completely cut up to the heat resistant base material and the adhesive layer, and the protective film is not completely cut in its thickness direction. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010050325(A) 申请公布日期 2010.03.04
申请号 JP20080213870 申请日期 2008.08.22
申请人 TOPPAN PRINTING CO LTD 发明人 MIYAHARA NORIHIKO;MEIRAKU YASUTAKA
分类号 H01L23/50 主分类号 H01L23/50
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