发明名称 |
Semiconductor package transformer |
摘要 |
The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
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申请公布号 |
US2010052152(A1) |
申请公布日期 |
2010.03.04 |
申请号 |
US20090461869 |
申请日期 |
2009.08.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI CHEOL HO |
分类号 |
H01L23/482;H01L23/538 |
主分类号 |
H01L23/482 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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