| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method.
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| 申请公布号 |
US2010051329(A1) |
申请公布日期 |
2010.03.04 |
| 申请号 |
US20090429042 |
申请日期 |
2009.04.23 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM TAE-HOON;KIM DONG-HOON;LEE YOUNG-IL;LEE SANG-GYUN;JUN BYUNG-HO;SHIM DA-MI |
| 分类号 |
H05K1/03;H05K1/09;H05K3/12 |
主分类号 |
H05K1/03 |
| 代理机构 |
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