| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is compact and has high heat dissipation characteristics. <P>SOLUTION: The semiconductor device includes: first and second electrode leads 11 and 12 disposed apart from each other; a semiconductor chip 13 mounted on a first surface 11a of the first electrode lead 11; a resin 14 for sealing the first electrode lead 11, second electrode lead 12 and semiconductor chip 13 while exposing a second surface 11b opposed to the first surface 11a of the first electrode 11 and a second surface 12b opposed to a first surface 12a of the second electrode lead 12; and wiring 15 formed on the resin 14 and having one side 15a connected to the semiconductor chip 13 by penetrating a part of the resin 14 which corresponds to the semiconductor chip 13 and the other side 15b connected to the second electrode lead 12 by penetrating a part of the resin 14 which corresponds to the second electrode lead 12. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
