COMPOUNDED METAL THIN FILM PARTICLE, DISPERSION OF COMPOUNDED METAL THIN FILM PARTICLE, INK FOR PRODUCING CONDUCTIVE CIRCUIT, METHOD FOR PRODUCING CONDUCTIVE CIRCUIT AND CONDUCTIVE CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a compounded metal thin film particle for conductive ink used for producing a conductive circuit having high conductive performance by simple equipment at low cost, to provide a conductive ink, to provide a method for producing the conductive circuit, and to provide the conductive circuit.

SOLUTION: The compounded metal thin film particle is produced from a process at least comprising: a first process where a compounded metal thin film layer at least including a resin layer or a wax layer and a metal or metal compound layer is formed on a sheet-shaped base material 501 face; and a second process where the compounded metal thin film layer is peeled from the sheet. In this way, the compounded metal thin film particle and conductive ink usable for a device producing a conductive circuit pattern-formed by a liquid process such as a screen printing method and an inkjet method can be obtained.

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