| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminate suitable for printed wiring substrate, and excellent in low water absorption properties, soldering heat resistance after moisture absorption, soldering heat resistance, electric characteristics, coefficient of linear expansion, property of having no air bubble, peeling strength to copper foil, and presentable appearance. <P>SOLUTION: The laminate is composed of (A) a thermoplastic resin composition containing not less than 80 mass% of polyphenylene ether and (B) a fibrous glass material. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
