EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, COPPER-CLAD LAMINATE, AND RESIN COMPOSITION FOR BUILD-UP ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving a cured product excellent in both heat resistance and copper foil releasing properties to a high degree, the cured product, a prepreg, a copper-clad laminate, and a build-up adhesive film. SOLUTION: The epoxy resin composition essentially comprises an epoxy resin (A) and a curing agent (B). The curing agent (B) is a modified phenol resin having a molecular structure, wherein 40-95% of phenolic hydroxy groups in a novolak type phenol resin is alkyl esterified or aryl esterified, and having a softening point within the range of 100-140°C. COPYRIGHT: (C)2010,JPO&INPIT