发明名称 NITRIDING METHOD FOR BASE MATERIAL SURFACE BY HOT WIRING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of nitriding a base material surface, such as a semiconductor or a metal or the like, under a relatively mild condition by the hot wiring method (the hot wiring CVD method). SOLUTION: In a hot wiring method consisting of contacting a nitrogen-containing gas to a heated catalyser, of reacting a chemical seed generated by the catalytic cracking reaction with a base material surface, and of forming a nitride film on the base material surface, the method of nitriding the base material surface includes using a gas obtained by adding hydrogen of 10% or less to a nitrogen gas as the nitrogen-containing gas. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010050252(A) 申请公布日期 2010.03.04
申请号 JP20080212634 申请日期 2008.08.21
申请人 KYUSHU INSTITUTE OF TECHNOLOGY 发明人 IZUMI AKIRA;INAO HARUKI;NAKAMURA IKUHIRO
分类号 H01L21/318 主分类号 H01L21/318
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