| 摘要 |
PROBLEM TO BE SOLVED: To provide a dividing method of a wafer which is able to effectively use expensive functional tapes. SOLUTION: A dicing tape is pasted on an annular frame which comprises an opening part to enclose a wafer with the opening part closed. With the wafer pasted to the dicing tape, a planned division line of the wafer is cut to divide the wafer into respective chips. The dicing tape comprises a first dicing tape which closes the opening part of the annular frame, and a second dicing tape which has the size corresponding to that of the wafer arranged on the first dicing tape. The second dicing tape is a functional tape whose adhesive force degrades due to external stimulation. The wafer which is pasted to the second dicing tape is cut along a planned division line so that it is divided into respective chips. COPYRIGHT: (C)2010,JPO&INPIT
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