| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrolytic copper foil for a printed wiring board at a low cost, which is excellent in adhesion between a glossy surface of the copper foil and a resist, and allows low profile by improving adhesive strength when the glossy surface is brought into close contact with a resin substrate. Ž<P>SOLUTION: The electrolytic copper foil 1 has pulse-like ruggedness having irregular and indefinite length formed by electrolytic polishing on the glossy surface 4 thereof. A method for electropolishing the glossy surface 4 of the electrolytic copper foil 1 is characterized in that an electrolytic polishing treatment is applied on the glossy surface 4 of the electrolytic copper foil 1 by using a sulfuric acid-copper sulfate bath as an electrolytic solution. In the method for electropolishing the glossy surface 4 of the electrolytic copper foil 1, an anode 3 is arranged at the rough surface side 2 of the electrolytic copper foil 1, a cathode 5 is arranged at the glossy surface 4 side, and then an electrolytic treatment is performed to apply a smooth plating treatment to the rough surface 2 of the copper foil 1, and at the same time, to apply a reverse electrolytic polishing treatment to the glossy surface 4 of the copper foil 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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