| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat conduction sheet with improved heat diffusion efficiency. Ž<P>SOLUTION: The heat conduction sheet 10 is arranged between a semiconductor chip 20 and a heat sink 30, and includes: an SiC substrate 12; a carbon nano structure layer 11 constituting a contact surface with the semiconductor chip and grown from one surface of the SiC substrate 12; and a carbon nano structure layer 13 constituting a contact surface with the heat sink and grown from the other surface of the SiC substrate 12. At least one of the carbon nano structure layers 11, 13 includes at least one among a carbon nano wall, a carbon nano flake, a carbon nano tube, a carbon nano leaf, and graphite. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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