| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which can form a low-dielectric constant polyimide film having heat-resistance and chemical resistance, and to provide a film or coating film formed by using the resin composition. Ž<P>SOLUTION: The resin composition contains an imido compound having an ethynyl group and a phenylene ether oligomer. A film or coating film is formed by using the resin composition. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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