| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR |
| 摘要 |
In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package.
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| 申请公布号 |
US2010052145(A1) |
申请公布日期 |
2010.03.04 |
| 申请号 |
US20090616453 |
申请日期 |
2009.11.11 |
| 申请人 |
CELAYA PHILLIP;LETTERMAN JR JAMES P |
发明人 |
CELAYA PHILLIP;LETTERMAN, JR. JAMES P. |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
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| 主权项 |
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