CHIP DIE CLAMPING DEVICE AND TRANSFER METHOD

摘要

According to an aspect of the invention, there is provided a chip die clamping device (1) arranged for placement of chip dies (2) in a chip manufacturing process, comprising a carrier plate (3) comprising compartmented clamping zones (4) on a top face (5) arranged for placement of a diced wafer (20); and a vacuum circuit arranged for providing a vacuum clamping pressure to the clamping zones (4). A gas supply mechanism (6) is arranged to locally cancel the vacuum clamping pressure in a specified clamping zone (4) and a controller arranged for controlling the gas supply mechanism (6) to release a selected die (2') of the diced wafer (20) in response to received pick and place instructions. Advantages may include less breakdown risk in the pick and place process.