| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device suppressing the generation of conductive cutting wastes in association with blanking. <P>SOLUTION: In the tape carrier 1 for the semiconductor device, a plurality of semiconductor devices 11 having a semiconductor chip 31 and a plurality of wirings 21a and 22a that are electrically connected with the semiconductor chip 31 are juxtaposed in a row. In each of a plurality of the wirings 21a and 22a, there is formed an electrode pad 23 that is used for the workmanship inspection of the semiconductor device 11 at one end part and used for connecting the semiconductor device 11 to an external connection terminal. The electrode pad 23 is arranged in the inner side than a cutting line C1 to be blanked for obtaining the semiconductor device 11 together with the semiconductor chip 31 and a plurality of wirings 21a and 22a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
