| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor substrate capable of easily and accurately recognizing whether defects in an element region pattern detected in a defect inspecting process, occur due to reticles or not in a short period of time, when applying a plurality of exposures to form a plurality of exposure shot regions to be aligned on the semiconductor substrate. <P>SOLUTION: In the reticle, for instance, four element region patterns are formed and identification patterns are formed between each of element region patterns and two element region patterns vertically or horizontally adjoining. Element region patterns and identification patterns are transferred to a resist on a semiconductor substrate 201 using the reticle, and element region patterns 12A and identification patterns 15A showing relationships among two adjoining element region patterns 12A are formed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
