发明名称 ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD
摘要 The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
申请公布号 US2010051338(A1) 申请公布日期 2010.03.04
申请号 US20090613222 申请日期 2009.11.05
申请人 TAKAI KENJI;MORIIKE NORIO;KAMIYAMA KENICHI;WATANABE TAKAKO;TAKANEZAWA SHIN;MORITA KOJI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI 发明人 TAKAI KENJI;MORIIKE NORIO;KAMIYAMA KENICHI;WATANABE TAKAKO;TAKANEZAWA SHIN;MORITA KOJI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI
分类号 H05K1/02;B32B3/00;H05K1/00;H05K3/00;H05K3/10;H05K3/28;H05K3/38;H05K3/46 主分类号 H05K1/02
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