发明名称 Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings
摘要 Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
申请公布号 US2010051466(A1) 申请公布日期 2010.03.04
申请号 US20090506547 申请日期 2009.07.21
申请人 MICROFABRICA INC. 发明人 SMALLEY DENNIS R.;COHEN ADAM L.;KUMAR ANANDA H.;LOCKARD MICHAEL S.
分类号 C25D1/20;C25D5/10 主分类号 C25D1/20
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