FILM WITH METAL FILM

摘要

Disclosed is a method for manufacturing a circuit board, wherein an insulating layer and a metal film layer having excellent adhesion to the insulating layer and excellent uniformity can be formed efficiently.  The method exhibits excellent laser processability during formation of a blind via by laser.  Also disclosed are a film with a metal film and an adhesive film with a metal film, which are used in the method for manufacturing a circuit board. Specifically disclosed is a film with a metal film comprising a supporting layer, a releasing layer formed on the supporting layer, and a metal film layer formed on the releasing layer, said film with a metal film being characterized in that at least a surface of the releasing layer, which is in contact with the metal film layer, is composed of one or more water-soluble resins selected from water-soluble cellulose resins, water-soluble polyester resins and water-soluble acrylic resins, and that the water-soluble resins contain one or more materials selected from metal compound powders, carbon powders, metal powders and black dyes.  Also specifically disclosed is an adhesive film with a metal film wherein a curable resin composition layer is formed on the metal film layer of the film with a metal film.