MOLD RELEASE FILM FOR MANUFACTURING SEMICONDUCTOR RESIN PACKAGE AND SEMICONDUCTOR RESIN PACKAGE MANUFACTURING METHOD USING SAME

摘要

Provided are: a mold release film, which has excellent mold releasability to a semiconductor resin package and does not easily generate warpage, wrinkles and the like; and a method for obtaining a semiconductor resin package having excellent dimensional accuracy by using such mold release film.  The mold release film for manufacturing a semiconductor resin package has one or more base material layers (C), a pair of outermost layers (A) which sandwich the base material layers (C) and contain a 4-methyl-1-pentene polymer as a main component, and a pair of adhesive layers (B) which adhere together the base material layers (C) and the outermost layers (A).