BONDING FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY, BONDING FILM THEREFROM, AND DICING DIE BOND FILM COMPRISING THE SAME,申请号KR20070133086-传众专利搜索

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发明名称	BONDING FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY, BONDING FILM THEREFROM, AND DICING DIE BOND FILM COMPRISING THE SAME
摘要
申请公布号	KR100945635(B1)	申请公布日期	2010.03.04
申请号	KR20070133086	申请日期	2007.12.18
申请人		发明人
分类号	C09J163/00;C09J7/00;C09J7/02;C09J183/04	主分类号	C09J163/00
代理机构		代理人
主权项
地址

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